材料科学
热导率
聚合物
混溶性
无定形固体
复合材料
有机化学
化学
作者
Gun-Ho Kim,Dongwook Lee,Apoorv Shanker,Lei Shao,Min Sang Kwon,David W. Gidley,Jinsang Kim,Kevin P. Pipe
出处
期刊:Nature Materials
[Springer Nature]
日期:2014-11-24
卷期号:14 (3): 295-300
被引量:467
摘要
Thermal conductivity is an important property for polymers, as it often affects product reliability (for example, electronics packaging), functionality (for example, thermal interface materials) and/or manufacturing cost. However, polymer thermal conductivities primarily fall within a relatively narrow range (0.1-0.5 W m(-1) K(-1)) and are largely unexplored. Here, we show that a blend of two polymers with high miscibility and appropriately chosen linker structure can yield a dense and homogeneously distributed thermal network. A sharp increase in cross-plane thermal conductivity is observed under these conditions, reaching over 1.5 W m(-1) K(-1) in typical spin-cast polymer blend films of nanoscale thickness, which is approximately an order of magnitude larger than that of other amorphous polymers.
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