电镀(地质)
电镀
阴极
阳极
镀金(软件工程)
材料科学
迷惑
电流密度
薄脆饼
图层(电子)
复合材料
光电子学
电气工程
机械工程
电极
化学
计算机科学
工程类
物理
物理化学
地球物理学
软件工程
量子力学
作者
Jing Xiang,Hongzhi Zhang,Yongqiang Su,Zeng Chong,Chong Wang,Yaning Lin,Liangliang Tian,Guohui Hu
摘要
The uniformity of gold plating of 6-inch wafers in conventional sulfate plating solution was studied by numerical simulation technology. The effects of current density, cathode and anode distance and baffle distance on plating uniformity were studied to obtain the gold plating layer with the uniformity of less than 5%. The results show that when the distance between the cathode and the anode is set to be 15.5 cm, and the distance between the baffle and the cathode is 4.5 cm, when the current density is 5-15A/m2, the uniformity of electroplating gold is less than 5%, which meets the production requirements.
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