材料科学
胶粘剂
粘附
电场
纳米技术
图层(电子)
共价键
阳极
复合材料
化学工程
高分子化学
电极
有机化学
化学
物理
量子力学
物理化学
工程类
作者
Guohong Yao,Miaomiao Gao,Qiao Zhang,Xin Tan,Changyong Cai,Shengyi Dong
标识
DOI:10.1002/adma.202500648
摘要
Abstract Removing adhesive nondestructively and intact from the adhered surface is a difficult challenge for advanced adhesive materials. Compared with the commonly used thermal or chemical release, the controlled adhesive release via electric‐field offers practical application advantages. However, a noninvasive release mode such as this has not been available for the de‐bonding of supramolecular adhesives that originate from small organic molecules. Herein, a conductive hydrogel with surface adhesion and electric field‐triggered de‐adhesion and release is fabricated from thioctic acid ( TA ) and L‐arginine ( LA ). The non‐covalent intermolecular attractions of poly[ TA ‐ LA ], especially its electrostatic interactions, not only endow it with useful bulk‐state properties and strong adhesion (up to 363.3 kPa) but also generate electric responsiveness for on‐demand de‐adhesion and release. The poly[ TA ‐ LA ] adhesive layer can be easily released within a short time (<60 s) under a mild voltage (5≈10 V). After a combined experimental and theoretical investigation, It is concluded that the adhesive‐layer morphological and mechanical changes, activated by a weak current (1.1≈3.2 mA), are responsible for the adhesion failure, which takes place primarily at the anode. Importantly, rapid electric release of poly[ TA ‐ LA ] is applicable at low temperatures (5 V, 60 s, −40 °C) or underwater (5 V, 60 s, 25 °C).
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