亲爱的研友该休息了!由于当前在线用户较少,发布求助请尽量完整地填写文献信息,科研通机器人24小时在线,伴您度过漫漫科研夜!身体可是革命的本钱,早点休息,好梦!

Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process

材料科学 薄脆饼 研磨 复合材料 磨料 钻石 光电子学
作者
Hongfei Tao,Yuanhang Liu,Dewen Zhao,Xinchun Lu
出处
期刊:Tribology International [Elsevier BV]
卷期号:189: 108879-108879 被引量:12
标识
DOI:10.1016/j.triboint.2023.108879
摘要

In the field of advanced packaging, large-size silicon wafers are usually thinned by ultra-precision grinding technology relying on the process of workpiece self-rotation. However, the damage caused by mechanical material removal deteriorates the wafer surface flatness and die strength, while its atomic-scale formation principle has yet to be revealed. This work explores the ductile deformation and subsurface damage evolution mechanism of silicon wafer during the ultra-precision grinding process. Some grinding tests are first conducted using different diamond wheels. The surface topography and energy dispersive spectroscopy (EDS) mapping of ground wafers are measured by scanning electron microscope (SEM). The phase transition properties of the ground silicon wafer are confirmed via Raman spectrum. Next, the specimen of groove cross-section is fabricated and its morphology is examined via transmission electron microscopy (TEM) to analyze the subsurface damage characteristics. The subsurface defects at the atomic scale, involving amorphous layer, dislocations, stacking faults and lattice distortions, are observed. Due to its controllable load and similarity of the cutting motion, nanoscratch is utilized for investigating the influence of abrasive interactions on subsurface deformation during the grinding process. Thus, a series of multiple nanoscratch tests are performed in both varied and constant force modes. The material removal behaviors under different scratching conditions are illustrated. This work provides a fundamental understanding of developing a high-efficiency and low-damage thinning method for 12-inch silicon wafers.
最长约 10秒,即可获得该文献文件

科研通智能强力驱动
Strongly Powered by AbleSci AI
更新
PDF的下载单位、IP信息已删除 (2025-6-4)

科研通是完全免费的文献互助平台,具备全网最快的应助速度,最高的求助完成率。 对每一个文献求助,科研通都将尽心尽力,给求助人一个满意的交代。
实时播报
LZJ完成签到,获得积分10
4秒前
mind42发布了新的文献求助10
4秒前
mmyhn发布了新的文献求助200
6秒前
9秒前
小师叔完成签到,获得积分10
9秒前
11秒前
xiaoyu发布了新的文献求助10
15秒前
17秒前
19秒前
孙孙应助lQ采纳,获得10
19秒前
田一点发布了新的文献求助10
22秒前
田一点完成签到,获得积分10
27秒前
wansida完成签到,获得积分10
31秒前
喜悦宫苴完成签到,获得积分10
31秒前
36秒前
38秒前
辉哥发布了新的文献求助10
42秒前
量子星尘发布了新的文献求助10
43秒前
Lyl完成签到 ,获得积分10
46秒前
煜清清完成签到 ,获得积分10
52秒前
和谐山灵完成签到,获得积分20
55秒前
CodeCraft应助TIANNANXING采纳,获得10
57秒前
Akim应助辉哥采纳,获得10
57秒前
嗨是完成签到,获得积分10
59秒前
59秒前
1分钟前
英俊的铭应助耷拉地啦采纳,获得10
1分钟前
yang完成签到,获得积分10
1分钟前
搜集达人应助一只小锦鲤采纳,获得10
1分钟前
情怀应助白日梦采纳,获得10
1分钟前
NeilGu完成签到,获得积分10
1分钟前
1分钟前
星期五完成签到,获得积分10
1分钟前
TIANNANXING发布了新的文献求助10
1分钟前
聪明小于完成签到 ,获得积分10
1分钟前
1分钟前
火星上誉完成签到 ,获得积分10
1分钟前
1分钟前
天天摸鱼完成签到,获得积分10
1分钟前
zhao完成签到,获得积分10
2分钟前
高分求助中
A new approach to the extrapolation of accelerated life test data 1000
Picture Books with Same-sex Parented Families: Unintentional Censorship 700
ACSM’s Guidelines for Exercise Testing and Prescription, 12th edition 500
Nucleophilic substitution in azasydnone-modified dinitroanisoles 500
不知道标题是什么 500
Indomethacinのヒトにおける経皮吸収 400
Phylogenetic study of the order Polydesmida (Myriapoda: Diplopoda) 370
热门求助领域 (近24小时)
化学 材料科学 医学 生物 工程类 有机化学 生物化学 物理 内科学 纳米技术 计算机科学 化学工程 复合材料 遗传学 基因 物理化学 催化作用 冶金 细胞生物学 免疫学
热门帖子
关注 科研通微信公众号,转发送积分 3976600
求助须知:如何正确求助?哪些是违规求助? 3520689
关于积分的说明 11204470
捐赠科研通 3257316
什么是DOI,文献DOI怎么找? 1798683
邀请新用户注册赠送积分活动 877881
科研通“疑难数据库(出版商)”最低求助积分说明 806613