聚磷酸铵
环氧树脂
材料科学
热导率
微电子
复合材料
阻燃剂
复合数
氮化硼
热固性聚合物
可燃性
化学工程
纳米技术
工程类
作者
Shuheng Wang,Yichong Jiang,Xin Tong,Yongji Li,Jun Sun,Lijun Qian,Hongfei Li,Xiaoyu Gu,Sheng Zhang
标识
DOI:10.1016/j.polymdegradstab.2023.110606
摘要
Epoxy (EP) is widely used in the field of high-speed communication and microelectronics. However, its poor thermal conductivity and high flammability bury the hidden danger of fire accident. In this work, the hexagonal born nitride (h-BN) combined with ammonium polyphosphate (APP) constructs a three-dimensional skeleton (3D-BN) via bidirectional freezing technology. The 3D-BN skeleton is immersed into the EP matrix to obtain the EP/3D-BN composite, which is endowed with high thermal conductivity and flame retardancy. When the loading of hexagonal born nitride (h-BN) is 9.1 vol%, the thermal conductivity of EP/3D-BN3 composite reaches 1.67 W m−1 K−1, which is increased by 944 % compared with that of the control EP. The peak heat release rate (PHRR) and total heat release (THR) of EP/3D-BN3 are significantly reduced by 54 % and 34 % respectively. This EP/3D-BN composite provides potential applications toward the industrial production for microelectronic devices.
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