钻石
金刚石车削
GSM演进的增强数据速率
材料科学
机械加工
金刚石切割
热的
转折点
金刚石工具
点(几何)
硼
兴奋剂
刀具磨损
冶金
机械工程
光电子学
计算机科学
工程类
声学
几何学
化学
物理
有机化学
气象学
电信
数学
句号(音乐)
作者
Yuan-Liu Chen,Shiquan Liu,Xiaozhou Chen,Fang Deng
出处
期刊:CIRP Annals
[Elsevier]
日期:2023-01-01
卷期号:72 (1): 81-84
标识
DOI:10.1016/j.cirp.2023.04.048
摘要
Cutting temperature is important in single point diamond turning. However, the challenge of measuring temperature in single point diamond turning is locating a sensor at the cutting edge during machining. This paper presents a tool system having a capability of measuring cutting temperature in diamond turning by the tool itself without any additional temperature sensors. A diamond tool was doped with boron via high temperature and high pressure treatment, by which the tool becomes a P-type semiconductor and thus have a thermal-sensitive characteristic for indicating the cutting temperature at the cutting edge zone during diamond turning processes.
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