Wafer acceptance test structures for characterization of thermoelectric materials’ thermal conductivity of thermopile sensors

Abstract Thermopile sensors have a wide range of applications in consumer and industry. Thermopile is the key component of thermopile sensors, and thermal conductivity is a basic thermal parameter of thermopile. Extracting the thermal conductivity of thermoelectric materials in thermopile sensors is of great importance. In this work, wafer acceptable test structures that fabricated along with thermopile sensors are presented. They could guarantee the measured materials are identical to those used in thermopile sensors. The test results are consistent with the reported values, and the validity of structures is verified. This method has the advantages of on-line extraction over a wide temperature range, and simultaneous extraction of thermal conductivity of connecting wire.