Multiscale EMC Modeling, Simulation, and Validation of a Synchronous Step-Down DC-DC Converter

电磁兼容性 电磁干扰 电磁干扰 电子工程 波形 汽车工业 工程类 时域 计算机科学 电气工程 电压 计算机视觉 航空航天工程
作者
Rajen Murugan,Jie Chen,A. Tripathi,Bibhu Prasad Nayak,Harikiran Muniganti,Dipanjan Gope
出处
期刊:IEEE journal on multiscale and multiphysics computational techniques [Institute of Electrical and Electronics Engineers]
卷期号:8: 269-280 被引量:1
标识
DOI:10.1109/jmmct.2023.3276358
摘要

The proliferation of power electronics in automotive and industrial applications raises compliance challenges in meeting electromagnetic compatibility (EMC) regulatory standards. In this work, we develop a robust multiscale system-level modeling and simulation methodology for predicting CISPR 25 conducted emission (CE) and radiated emission (RE). The method is based on a novel two-stage process. In the first stage, the IC model is generated either by non-linear time-domain simulation using a device-level physics model or oscilloscope measurements if a prototype is available. In the second stage, the IC model waveforms are used in a simulation environment comprising 3D full-wave frequency domain analysis and specially prepared macro-models for the laboratory equipment. Silicon validation of CISPR 25 EMC measurements on a “low-EMI,” high-performance DCDC automotive/industrial synchronous step-down converter is presented to validate the integrity of the predictive modeling methodology. Good correlations between modeling and EMC-certified testing laboratory emission measurements are achieved (i.e., within +/- 3dBuV for CE and +/- 6dBuV for RE). As a result, the predictive EMC modeling methodology can be implemented, early in the design cycle, to ensure first-pass EMC-compliant design.
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