固化(化学)
残余应力
材料科学
收缩率
残余物
热的
材料性能
胶粘剂
复合材料
热力学
计算机科学
算法
物理
图层(电子)
作者
David Lindeman,Aaron T. Hedegaard,Chaodi Li,S H Carpenter
出处
期刊:Elsevier eBooks
[Elsevier]
日期:2023-01-01
卷期号:: 1011-1033
标识
DOI:10.1016/b978-0-323-91214-3.00011-9
摘要
This chapter provides an overview of the development of residual stresses in structural adhesives due to curing processes, and the experimental characterization and modeling of these processes. Experimental methods to characterize the conversion and temperature dependence of the material properties are discussed, and numerical methods for simulating curing processes to predict residual stresses are outlined. The modeling method described uses a coupled thermal-structural analysis procedure where the rate of conversion and the associated evolution of the mechanical properties, shrinkage and thermal strains, and heat generation rate are computed as functions of time and temperature. The testing performed to validate the curing model is described, and the correlation between measured and predicted values is discussed.
科研通智能强力驱动
Strongly Powered by AbleSci AI