晶片切割
材料科学
薄脆饼
半导体
伺服
光电子学
机械工程
汽车工程
工程类
作者
Fengjun Chen,Jianhang Huang,Jialiang Xu
标识
DOI:10.1016/j.jmapro.2024.03.033
摘要
The dicing of semiconductor wafers is an essential component for fabricating electronic circuits. A servo control approach with high-precision and stability was designed to enhance the positioning accuracy and stability for dicing semiconductor wafers. The principal control and dicing processes were studied. The High Definition closed-loop control algorithm was designed, and the control parameters were optimized. The control performance was enhanced using the PID + Feedforward + NOTCH filter control algorithm. The error detection of linear and rotation axes was designed to compensate servo axis errors by using the laser interferometer and control card. After error compensation, the positioning accuracy and repeatability of the Y-axis were 2.031 μm and 1.889 μm. That of the C-axis were 0.00423°, and 0.00347°. The dicing experiment revealed the maximum chipping width was <10 μm and the dicing channel width was <42 μm. The designed servo control system ensured the high-precision and stable dicing of semiconductor chips.
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