High-precision servo control design and optimization for dicing semiconductor wafer

The dicing of semiconductor wafers is an essential component for fabricating electronic circuits. A servo control approach with high-precision and stability was designed to enhance the positioning accuracy and stability for dicing semiconductor wafers. The principal control and dicing processes were studied. The High Definition closed-loop control algorithm was designed, and the control parameters were optimized. The control performance was enhanced using the PID + Feedforward + NOTCH filter control algorithm. The error detection of linear and rotation axes was designed to compensate servo axis errors by using the laser interferometer and control card. After error compensation, the positioning accuracy and repeatability of the Y-axis were 2.031 μm and 1.889 μm. That of the C-axis were 0.00423°, and 0.00347°. The dicing experiment revealed the maximum chipping width was <10 μm and the dicing channel width was <42 μm. The designed servo control system ensured the high-precision and stable dicing of semiconductor chips.