热固性聚合物
固化(化学)
材料科学
自催化
环氧树脂
等温过程
差示扫描量热法
复合材料
动力学
高分子化学
热力学
物理
量子力学
作者
Xiaosong Huang,Bhaskar Patham
摘要
Abstract This work describes in detail the kinetic model for the cure of an epoxy‐anhydride thermoset matrix resin system. The cure kinetics in both nonisothermal and isothermal modes has been characterized using differential scanning calorimetry. The Sestak–Berggren two‐parameter autocatalytic model was used to describe the nonisothermal cure behavior of the resin satisfactorily. The isothermal cure data was fitted with Kamal's four‐parameter autocatalytic model, coupled with a diffusion factor. These characterization data will form material property inputs for a multiscale modeling framework for the estimation of cure‐induced residual stresses in thick thermoset matrix composites. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013
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