数码产品
电子设备和系统的热管理
小型化
可靠性(半导体)
电子设备
传热
电子元件
电子系统
机械工程
热的
工程类
电气工程
电子工程
物理
功率(物理)
量子力学
气象学
热力学
出处
期刊:Journal of Electronic Packaging
[ASME International]
日期:1995-12-01
卷期号:117 (4): 333-339
被引量:247
摘要
Thermal control has become a critical factor in the design of electronic equipment because of the recent trends in the electronic industry towards increased miniaturization of components and device heat dissipation. A great demand on the system performance and reliability also intensifies the needs for a better thermal management. The further evidence of importance of thermal consideration to an electronic system is due to the survey by the U.S. Air Force indicating that more than fifty percent of all electronics failures are caused by the undesirable temperature control. This paper reviews recent technologies in thermal control and management of electronic equipment.
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