消散
辐射冷却
材料科学
电子设备和系统的热管理
涂层
热传导
传热
复合数
小型化
热辐射
辐射传输
保温
热力学
复合材料
光学
机械工程
纳米技术
物理
图层(电子)
工程类
作者
Hongkai Zhang,Desong Fan
标识
DOI:10.1002/ente.201901362
摘要
Heat dissipation has become a key issue in electronic devices with high integration and miniaturization. As an effective way of heat transfer, radiative cooling has aroused a great attention in these devices. However, heat dissipation based on radiative cooling coating is limited by the poor heat spreading and temperature nonuniformity. Herein, a synergic augment strategy of excellent thermal conduction and strong thermal emission is proposed to improve the heat dissipation and temperature uniformity of radiative cooling coating. By the strategy, a composite coating consisting of poly(vinylidene fluoride‐co‐hexafluoropropene) and graphite is designed. It is shown via experiment that heat dissipation in composite coating is enhanced by 7% during daytime. A large temperature reduction of about 15.5 °C is obtained at the surface of the heat source with a composite coating during daytime. The temperature difference of the surface for composite coating within 2 °C demonstrates that the temperature uniformity of radiative cooling coating is improved.
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