模具(集成电路)
晶片键合
薄脆饼
计算机科学
材料科学
光电子学
纳米技术
作者
Koen Kennes,Alain Phommahaxay,Alice Guerrero,Samuel Suhard,Pieter Bex,Steven Brems,Xiao Liu,Sebastian Tussing,Gerald Beyer,Eric Beyne
标识
DOI:10.1109/ectc51906.2022.00324
摘要
Several alternative carrier systems for collective die-to-wafer transfer, using the laser debonding technique, are evaluated. The principles of laser debonding are explained and applied to thin die transfer. A so called 'acoustic' layer needs to be present to avoid damage to the dies during the laser ablation process. The benefits and disadvantages of applying this layer to the glass carrier system rather than to the dies prior to singulation are explained. Three alternative carrier systems, based on BrewerBOND ® C1301-50 material and BrewerBOND ® T1107 release material, are designed and evaluated for die placement, protective layer strip, collective bonding and finally laser debonding. A quantitative analysis and comparison with a reference system containing the release layer and acoustic layer on the die prior to singulation is presented.
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