计量学
半导体工业
制造工程
系统工程
计算机科学
半导体器件制造
工程类
薄脆饼
电气工程
物理
光学
作者
Benjamin Bunday,A. F. Bello,Eric Solecky,Alok Vaid
摘要
This paper will provide an update to previous works [2][4][9] to our view of the future for in-line high volume manufacturing (HVM) metrology for the semiconductor industry, concentrating on logic technology for foundries. First, we will review of the needs of patterned defect, critical dimensional (CD/3D), overlay and films metrology, and present the extensive list of applications for which metrology solutions are needed. We will then update the industry's progress towards addressing gating technical limits of the most important of these metrology solutions, highlighting key metrology technology gaps requiring industry attention and investment.
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