材料科学
氮化硼
纳米片
复合材料
电子包装
热导率
纳米线
小型化
纳米技术
作者
Jianfeng Huang,Hua Li,Lijian Song,J. Li,M. Saleem,Zhaoqing Lu
标识
DOI:10.1016/j.mtsust.2022.100307
摘要
With the miniaturization and densification of electronic devices, thermal management materials have attracted scientists' attention due to the devices’ high heat dissipation. In this study, hydroxyethyl cellulose (HEC) and boron nitride nanosheets (BNNS) films (HB) coated with silver nanowires (AgNWs) were prepared using ball milling and solution-casting approach to achieve one side conduction and the other side insulation and heat conduction. HB/AgNWs1.0 film with conductivity (79.1 S/m), tensile strength (36.4 MPa), and thermal conductivity (0.244 W/m/K) were employed as bending sensors. The resistance of the HB/AgNWs1.0 film becomes larger with greater curvature due to the greater distance between one-dimensional rod-like AgNWs in the conductive network. Due to the good combination performance of AgNWs and HB composite film, the sensor can work normally for 1,000 times. Meanwhile, boron nitride nanosheets in the hydroxyethyl cellulose matrix can quickly remove the heat generated by the AgNW layer, which has a good prospect in the field of electronic packaging.
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