原子层沉积
结晶度
无水的
粘结强度
无定形固体
表面粗糙度
材料科学
沉积(地质)
化学工程
薄膜
分析化学(期刊)
化学
纳米技术
复合材料
结晶学
图层(电子)
有机化学
古生物学
胶粘剂
沉积物
工程类
生物
作者
Junsha Wang,Ryo Takigawa,Tadatomo Suga
标识
DOI:10.35848/1347-4065/acb656
摘要
Abstract Room temperature direct bonding of plasma enhanced ALD Al 2 O 3 films was achieved by using surface activated bonding. ALD Al 2 O 3 films were amorphous with C and O impurities contained. The high deposition power and H 2 plasma post-treatment increased the crystallinity and hydrophilicity of ALD Al 2 O 3 films, respectively. However, both methods increased the surface roughness of films slightly. The bond strength of ALD Al 2 O 3 films was not changed obviously by raising the deposition power, but it experienced a slight decrease after H 2 plasma post-treatment. The water in the debonding atmosphere influenced the bond strength of standard ALD Al 2 O 3 films greatly, which was 0.54 J m −2 in humid air and 1.00 J m −2 in anhydrous N 2 . The bond strength in vacuum was just a little larger than that in anhydrous N 2 suggesting that the trapped water at the bonding interface was less.
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