Tunable nonlinear conductive behavior without percolation threshold and high thermal conductivity of epoxy resin/SiC ceramic foam co-continuous phase composites

材料科学 复合材料 环氧树脂 渗流阈值 热导率 陶瓷 电介质 渗透(认知心理学) 导电体 复合数 热膨胀 电场 电阻率和电导率 工程类 物理 电气工程 生物 神经科学 量子力学 光电子学
作者
Huasong Xu,Bin Gou,Jie He,Yong Lu,Hui Chen,Licheng Li,Congzhen Xie,Xiao Matthew Hu
出处
期刊:Composites Science and Technology [Elsevier]
卷期号:236: 109984-109984 被引量:27
标识
DOI:10.1016/j.compscitech.2023.109984
摘要

Smart dielectrics with self-adaptive capabilities can exhibit desirable electric field-grading performance as the applied electric field exceeds a critical value. However, the conventional approaches to such dielectrics need heavy doping rate, which will not only increase the interface thermal resistance and limit the improvement of thermal conductivity, but also severely sacrifice the mechanical property. In this contribution, a new type of electric field-grading co-continuous phase composite (EP/SiCcf) composed of epoxy resin and SiC ceramic foam was prepared to realize tunable nonlinear conductive performance, while simultaneously improving thermal and mechanical properties. Results show that there is no percolation threshold for all EP/SiCcf composites. The volume loadings of EP/SiCcf composites range from 8.7 vol% to 15.6 vol%, while the nonlinear coefficient subjected to potential barrier height increases from 2.1 to 4.5 and the switching field tuned by barrier width decreases from 1008 V/mm to 686 V/mm. The EP/SiCcf40 still exhibits sharp thermal conductivity enhancement of about 1000% and glass transition temperature enhancement of 10.8 °C. The surface temperature fluctuation over time during heating and cooling has illustrated the prospective application of thermal management capability. In addition, the dynamic mechanical analysis reveals that all EP/SiCcf composites have the significantly improved storage modulus and crosslinking density ascribed to the intact SiC skeleton. The novel co-continuous phase composite provides a new approach for global enhancement of smart dielectric composites in potential applications.
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