Mitigating interface damping of metal adhesion layers of nanostructures through bright-dark plasmonic mode coupling

Metal (such as Cr, Ti, etc.) adhesion layers, which are generally used to prevent nanostructures from falling off during electron beam lithography processes, will introduce interface damping, decrease the near-field enhancement, and shorten the dephasing time of localized surface plasmons (LSP). Maintaining metal adhesion layers while alleviating the induced interface damping in nanostructures is crucial for high-performance sensing, surface-enhanced Raman scattering elements, plasmon-based photocathodes, and plasmon-mediated catalysis. Here, we experimentally demonstrated that the mitigation of interface damping of metal adhesion layers can be achieved through the coupling between the bright and dark plasmonic modes of gold nanorods. We attribute the mitigation to stronger confinement across the plasmon energy, which effectively reduces the proportion of plasmon energy injected into the Cr adhesive layers. Compared to weak coupling, the non-radiative damping of plasmonic modes 1 and 2 is reduced by approximately 74% and 85%, respectively, under strong coupling conditions. The experimental results are supported by finite-difference time-domain simulations and are well explained by the calculated interaction potential for different gap sizes. This research will further benefit applications where low interface damping is required, such as the construction of low-threshold nanolasers and ultrasensitive sensing systems.