亲爱的研友该休息了!由于当前在线用户较少,发布求助请尽量完整地填写文献信息,科研通机器人24小时在线,伴您度过漫漫科研夜!身体可是革命的本钱,早点休息,好梦!

Investigating the Role of Fluid Dynamics on Cut Width Accuracy in Wet Bevel Cleaning Techniques

斜面 动力学(音乐) 计算机科学 机械工程 石油工程 材料科学 工程制图 工程类 声学 物理
作者
Rencheng Dong,Akira Fujita,Derek Bassett,K. Shinohara,Shuhei Takahashi,Ihsan Simms
出处
期刊:Meeting abstracts 卷期号:MA2024-02 (31): 2280-2280
标识
DOI:10.1149/ma2024-02312280mtgabs
摘要

As the size of advanced technology nodes keeps scaling down, IC manufacturers continue to push the active die area to the wafer edge. Defects originating from the wafer edge can result in substantial yield loss. Etching and cleaning bevel films and particles is increasingly critical in improving wafer yield performance near the wafer edge. Even though backside center dispense spin (BCS) and bevel nozzle dispense spin (BVS) methods have been developed and employed as two main wet bevel cleaning techniques in high volume manufacturing, the comparison of cut width accuracy between different wet bevel cleaning techniques has not been fully studied. The goal of this study is to investigate and understand the effects of fluid dynamics on cut width accuracy in different wet bevel cleaning techniques (i.e. BCS and BVS). In this study, computational fluid dynamics (CFD) numerical models were developed to study the chemical liquid flow in wet bevel cleaning processes. In the BCS process, the chemical liquid is dispensed through a nozzle below the center of wafer backside while the wafer is spinning. In order to characterize the cut width profile after BCS process, the liquid flow was modeled under the coordinate system of the rotating wafer instead of the regular stationary coordinate system. This special type of model allows understanding how the liquid is distributed on the wafer surface with respect to the rotating wafer, which will be more straightforward to be compared with the measurement of cut width profile. For the BCS process, the simulation results of liquid flow on the wafer backside surface are shown in Fig. 1 . Due to the increasing centrifugal force towards the wafer edge, the liquid flow starts to develop some branching patterns. The liquid velocity ( Fig. 1(a) ) and liquid film thickness ( Fig. 1(b) ) are not axisymmetric anymore. Fig. 2 shows a vertical cross section of liquid flow at the wafer edge. The frontside etching in BCS relies on this liquid wrap-around flow. Due to the inertia and capillary force effects, the liquid first climbs from wafer backside to frontside as shown in Fig. 2(a) . The liquid volume keeps increasing as liquid accumulates around the wafer edge as shown in Fig. 2(b) . When the liquid volume at wafer bevel is greater than a certain threshold, the extra liquid will be stripped from the continuous liquid film as shown in Fig. 2(c) . Because this wrap-around flow is unstable and periodic, the leading edge of the liquid on wafer frontside always fluctuates during BCS process as shown in Fig. 3 . The non-axisymmetric backside flow leads to non-axisymmetric wrap-around flow on the wafer frontside. Because the liquid wrap-around flow is spatially non-axisymmetric and temporally unstable, the cut width profile over the whole perimeter of wafer bevel region can be quite non-uniform as shown in Fig. 4(a) . In the BVS process, the chemical liquid is dispensed through a nozzle above the frontside bevel region as shown in Fig. 5 . After the liquid jet lands on the rotating wafer, the liquid will develop into a stable circular flow along the wafer edge as shown in Fig. 5(a) . A vertical cross section of the liquid film flow is plotted in Fig. 5(b) . The inner cut position of the liquid film flow dictates the cut width in the BVS process. Because this circular liquid flow during BVS process is more stable, the cut width profile is more uniform in the BVS process as shown in Fig. 4(b) . In practice, the cut width profile after the BCS process is also dependent on the properties of wafer surface such as wafer surface wettability. If the wafer surface is hydrophobic, the liquid flow on the wafer backside surface can break up, which results in very limited wrap-around flow and limited etching at the wafer edge. Therefore it can be difficult to use the BCS technique to etch the hydrophobic bevel films. On the other hand, the circular liquid flow in the BVS process is less affected by the properties of wafer surface because the liquid is directly dispensed over the bevel region. It is much easier to achieve the cut width target using the BVS technique by adjusting operation conditions such as the nozzle position. Since the numerical model developed in this study can accurately represent the flow physics in the BVS process, this CFD model can be adopted as a digital twin of the BVS tool to optimize the BVS process conditions based on the film material properties (e.g., contact angle) to meet the cut width target. Figure 1

科研通智能强力驱动
Strongly Powered by AbleSci AI
更新
PDF的下载单位、IP信息已删除 (2025-6-4)

科研通是完全免费的文献互助平台,具备全网最快的应助速度,最高的求助完成率。 对每一个文献求助,科研通都将尽心尽力,给求助人一个满意的交代。
实时播报
正直雍发布了新的文献求助10
4秒前
13秒前
15秒前
所所应助科研通管家采纳,获得10
15秒前
李健的小迷弟应助DMIAN采纳,获得30
17秒前
量子星尘发布了新的文献求助10
19秒前
tszjw168完成签到 ,获得积分10
29秒前
舒适的映易完成签到,获得积分10
54秒前
我是老大应助ceeray23采纳,获得20
1分钟前
1分钟前
wyw完成签到 ,获得积分10
1分钟前
Sherlock完成签到,获得积分10
1分钟前
去晒月亮发布了新的文献求助30
1分钟前
zommen完成签到 ,获得积分10
1分钟前
1分钟前
ceeray23发布了新的文献求助20
1分钟前
ColinWine完成签到 ,获得积分10
1分钟前
小彤完成签到 ,获得积分10
1分钟前
量子星尘发布了新的文献求助10
1分钟前
orixero应助ceeray23采纳,获得20
1分钟前
blenx完成签到,获得积分10
2分钟前
英姑应助科研通管家采纳,获得10
2分钟前
传奇3应助科研通管家采纳,获得10
2分钟前
2分钟前
ceeray23发布了新的文献求助20
2分钟前
CNY完成签到 ,获得积分10
2分钟前
赘婿应助无私的香菇采纳,获得10
2分钟前
健壮的花瓣完成签到 ,获得积分10
2分钟前
称心的海蓝完成签到,获得积分10
2分钟前
2分钟前
ceeray23发布了新的文献求助20
2分钟前
酷酷幻灵完成签到 ,获得积分10
3分钟前
恻隐发布了新的文献求助10
3分钟前
星辰大海应助正直雍采纳,获得10
3分钟前
3分钟前
3分钟前
Hello应助恻隐采纳,获得10
3分钟前
正直雍发布了新的文献求助10
3分钟前
量子星尘发布了新的文献求助10
3分钟前
kd1412应助正直雍采纳,获得30
3分钟前
高分求助中
Picture Books with Same-sex Parented Families: Unintentional Censorship 1000
A new approach to the extrapolation of accelerated life test data 1000
ACSM’s Guidelines for Exercise Testing and Prescription, 12th edition 500
Indomethacinのヒトにおける経皮吸収 400
Phylogenetic study of the order Polydesmida (Myriapoda: Diplopoda) 370
基于可调谐半导体激光吸收光谱技术泄漏气体检测系统的研究 310
宽量程高线性度柔性压力传感器的逆向设计 300
热门求助领域 (近24小时)
化学 材料科学 医学 生物 工程类 有机化学 生物化学 物理 内科学 纳米技术 计算机科学 化学工程 复合材料 遗传学 基因 物理化学 催化作用 冶金 细胞生物学 免疫学
热门帖子
关注 科研通微信公众号,转发送积分 3980873
求助须知:如何正确求助?哪些是违规求助? 3524650
关于积分的说明 11222252
捐赠科研通 3262110
什么是DOI,文献DOI怎么找? 1801072
邀请新用户注册赠送积分活动 879591
科研通“疑难数据库(出版商)”最低求助积分说明 807429