聚醚酰亚胺
材料科学
电介质
纳米复合材料
纳米颗粒
复合材料
聚合物
聚合物纳米复合材料
化学工程
纳米技术
光电子学
工程类
作者
Binzhou Sun,Zongqiang Guo,Jian Wang,Zihan Zhao,Tianjiao Yu,Zhonghui Shen,Jing Wang,Penghao Hu
标识
DOI:10.1002/smtd.202401059
摘要
Abstract To enhance the high‐temperature energy storage performance of the polymer‐based dielectric film, inorganic nanofillers with large band gaps are much more effective and have been widely adopted. However, the impact of nanoparticle diameters on the dielectric properties of polymer nanocomposites has been less studied. Herein, silicon dioxide nanoparticles (SiO 2 ‐NPs) with varying diameters (20, 60, 120, 200 nm) prepared by the sol‐gel method are incorporated in the PEI matrix to form PEI/SiO 2 nanocomposites. The characterization results reveal a distinct correlation between the dielectric properties of polyetherimide (PEI) composites and the diameters of SiO 2 ‐NPs. Leakage current density analysis and breakdown strength simulations indicate that SiO 2 ‐NPs with smaller diameters generate more deep traps that impede the transport of charge carriers, especially under high temperatures. Notably, PEI/20 nm‐SiO 2 exhibits a high discharged energy density of 4.4 J cm −3 with an efficiency of 90% at 150 °C. Furthermore, PEI/SiO 2 films with 10 µm in thickness are manufactured by a large‐scale solution casting process. The continuously prepared PEI/20 nm‐SiO 2 film exhibits a discharged energy density of 3.2 J cm −3 with an efficiency of 90% at 150 °C. This study not only provides a strategy for the design of high‐performance dielectric polymer composites but also offers a large‐scale high‐temperature dielectric film for practical use.
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