Constructing three‐dimensional boron nitride network for highly thermally conductive epoxy resin composites

Abstract Construction of heat conduction channels in polymer matrix plays a key role in thermally conductive composite. In this work, three‐dimensional (3D) boron nitride (BN) framework was successfully fabricated by decomposing the sacrificial material. The resultant 3D‐BN framework with honeycomb‐like structure was further infiltrated with liquid epoxy resin. With the aid of thermally conductive pathways formed by the 3D‐BN framework, the maximum thermal conductivity of EP/3D‐BN composites reaches 3.53 W/m·K with 55.85 vol% BN, which is 17.6 times larger than that of pure EP. The EP/3D‐BN composites demonstrate strong capability to dissipate the heat during heating and cooling processes. This work provides a facile method for developing thermal conductive composites applied in thermal management for electronics.