残余应力
材料科学
纳米压痕
电子背散射衍射
纹理(宇宙学)
衍射
复合材料
模数
压力(语言学)
结晶学
冶金
光学
微观结构
物理
哲学
人工智能
图像(数学)
化学
语言学
计算机科学
作者
Wei He,Yinli Chen,Zulai Li,Yina Zhao,Wei Yu,Lan Su,Tang Di,Fei Zhang
标识
DOI:10.1016/j.engfracmech.2022.108658
摘要
This work uses high-energy synchrotron X-ray diffraction (HEXRD), atomic force microscope (AFM), nanoindentation and EBSD technology to explore a new method for measuring residual stress in strong R {1 2 4} 〈2 1 1〉 texture alloys, and the distribution of residual stress and Young's modulus in different crystal orientations. Compared with the traditional Voigt and Reuss model, for the textured Cu-Ni-Si-Co alloy, a local Voigt and Reuss inter-grain interaction model based on HEXRD diffraction technology is established, which can more accurately characterize the residual stress of superficial layer (230 μm). The local stress model provides a new X-ray diffraction method for testing the residual stress of textured materials. Aiming at the textured Cu-Ni-Si-Co alloy with compressive stress, the quasi-in-situ method combining EBSD and nanoindentation is used to characterize the residual stress of different crystal orientations in the microdomain. The hard orientation [1 1 1] grain direction has the highest residual stress, and the soft orientation [1 0 0] grain direction has the lowest residual stress, and the residual compressive stress in the hard orientation is about twice that of the soft orientation. In addition, the Young's modulus of the material is also the largest on [1 1 1] hard-oriented grains and the smallest on [1 0 0] soft-oriented grains.
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