An experimental investigation on the thermal efficiency of fractal tree-like microchannel nets

In this paper, a fractal tree-like microchannel net heat sink (20 mm × 20 mm × 1.4 mm) for cooling of electronic chips was fabricated on a silicon wafers by advanced MEMS technology. The length, width and height of the entrance microchannel were 10 mm, 800 μm and 25 μm, respectively. The fractal dimension D and the circulation number m of the fractal tree-like microchannel net were 2 and 4, respectively. It is confirmed experimentally that the thermal efficiency (defined as heat transfer rate per unit power required) of such a fractal tree-like microchannel heat sink is much higher than that of the traditional parallel microchannel heat sink for the same heat transfer rate, the same temperature difference and the same inlet velocity.