Oxidation and Corrosion Resistance of Nanocrystalline Copper Deposit Produced by Pulse Electrodeposition

Pulse electrodeposition was used to produce nanocrystalline (nc) copper from copper sulfate electrolyte with saccharin as additive. The grain size of nanocrystalline coatings was determined using x-ray diffraction and atomic force microscopy (AFM) which was about 30 nm. Microcrystalline copper deposits were also produced by direct current electrodeposition processes and compared with pulse plated ones. Corrosion behavior of the coatings was investigated using polarization and Impedance measurements in different solutions. The oxidation test was carried out at 650°C in an electrical furnace. It was demonstrated that the nanocrystalline film was markedly superior to regularly grained films made by direct current (DC) plating; nanocrystalline deposits show higher corrosion resistance and much higher oxidation resistance.