可塑性
延伸率
铜
脆性
晶界
极限抗拉强度
材料科学
开裂
拉伸试验
复合材料
冶金
微观结构
作者
Tiehui Fang,Wenwen Li,N.R. Tao,K. Lu
出处
期刊:Science
[American Association for the Advancement of Science (AAAS)]
日期:2011-02-18
卷期号:331 (6024): 1587-1590
被引量:1432
标识
DOI:10.1126/science.1200177
摘要
Nanometer-sized grain copper confined by a graded substrate leads to a material with both high strength and high ductility.
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