Thermophysical properties of some Low Temperature Lead-Free solder pastes dedicated to automotive applications

The maximum temperature of all parts of automotive electronics equipment is given by the location and can vary between 358 K and 478 K. RoHS EU Directive in the context of the manufacturing costs reduction, necessity led automotive industry to create new Low-Temperature Lead-Free (LTLF) solder pastes family. In the paper, the thermophysical properties of the alloys from ALPHA ^® CVP-520 (SnBiAg) and ALPHA ^® OM-535 (SBX02) test samples having as a source solder pastes were compared with similar from ALPHA ^® OM-6106 (Sn62) solder paste. The presented work extend the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry.