期刊:IEEE Electron Device Letters [Institute of Electrical and Electronics Engineers] 日期:2019-07-29卷期号:40 (9): 1399-1402被引量:176
标识
DOI:10.1109/led.2019.2931697
摘要
This letter demonstrates vertical Ga 2 O 3 Schottky barrier diodes (SBDs) with a novel edge termination, the small-angle beveled field plate (SABFP), fabricated on thinned $\text{G}_{{2}}\text{O}_{{3}}$ substrates. Non-punch-though design is used for the drift region with a donor concentration of ${3}\sim {3.5} \times {10} ^{{16}}$ cm −3 , rendering a device differential ON-resistance of $\sim 2~\text{m}\Omega ~\cdot $ cm 2 . A new wet-etch technique is developed by using a bi-layer mask, which consists of spin-on-glass (SOG) and plasma-enhanced chemical vapor deposited (PECVD) SiO 2 , to fabricate a very small bevel angle (∼ 1°) in the mesa and field plates. This SABFP structure facilitates the electric field spreading at device edges, rendering a breakdown voltage of 1100 V, a peak electric field of 3.5 MV/cm in Ga 2 O 3 at the Schottky contact edge, and an averaged electric field over 3.4 MV/cm underneath the contact. Our device demonstrates a Baliga's figure of merit of 0.6 GW/cm 2 , which is among the highest in all reported Ga 2 O 3 power devices and comparable to the state-of-the-art GaN SBDs. These results show the great potential of Ga 2 O 3 SBDs for future power applications.