An 84.48 Gb/s CMOS D-band Multi-Channel TX System-in-Package

This paper presents an in-package D-band wireless module co-integrating an innovative channel bonding transmitter IC in 45 nm CMOS PDSOI technology and a patch antenna fabricated using a low-cost printed circuit board process. The transmitter is composed of two up-conversion chains with dedicated millimeter-wave local oscillator generators and operates over contiguous sub-bands around 147.96 GHz. The two sub-band signals are combined off-chip using a substrate integrated waveguide diplexer and radiated by a four-patch antenna array realized on the same laminate substrate. The total output band spans from 139.3 to 156.6 GHz. A data rate of 84.48 Gb/s is demonstrated using 64-QAM. The radiated power is 3.8 dBm at the output 1 dB compression point. The chip consumes 600 mW from a 1-V voltage supply and occupies a compact area of 4.8mm ² .