Inserting insulating barriers into conductive particle channels: A new paradigm for fabricating polymer composites with high dielectric permittivity and low dielectric loss

材料科学 电介质 复合材料 介电损耗 导电体 介电常数 钛酸钡 渗流阈值 复合数 偶极子 电场 高-κ电介质 陶瓷 电阻率和电导率 光电子学 电气工程 工程类 物理 有机化学 化学 量子力学
作者
Wei Wu,Xueqing Liu,Zhe Qiang,Jiying Yang,Yuhong Liu,Kai Huai,Bailang Zhang,Shuxiang Jin,Yueyuan Xia,Kun Fu,Jianming Zhang,Yuwei Chen
出处
期刊:Composites Science and Technology [Elsevier]
卷期号:216: 109070-109070 被引量:20
标识
DOI:10.1016/j.compscitech.2021.109070
摘要

A longstanding challenge in fabricating high dielectric polymer composite is how to rationalize structure design to improve dielectric permittivity while minimizing dielectric loss. Typically, adding conductive particles in to the composite often leads to an increase in the dielectric loss caused by leakage current due to ‘insulator-conductor’ transition at the percolation threshold. This work presents a strategy for simultaneously assembling conductive and insulating particles to form chainlike structures, based on dipole-dipole interactions induced by electric fields. Specifically, insulating barium titanate (BaTiO3) particles can be subtly embeded in the conductive graphite channels to serve as barriers. The formation of such morphology plays an important role for balancing the high dielectric permittivity and relatively low dielectric loss for conductive fillers/polymer composite systems. With only 2.5 wt% graphite, the dielectric permittivity can be enhanced significantly upon electric field induced assembly, while the dielectric loss also inevitably increases to 396. By incorporating additional 5 wt% BaTiO3 (barriers), we are able to reduce the dielectric loss to as low as 0.19 while the dielectric permittivity still remains relatively high (73.5). This work provides a critical material design concept for high-performance flexible dielectric materials based on creating barriers through the assistance of electric fields in ternary composites, which prevents the generation of leakage current between conductive fillers interfaces.
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