Picosecond laser machining of tungsten carbide

Hard materials such as tungsten carbide (WC) are extensively used in cutting tools in high-value manufacturing, and the machining of these materials with sufficient speed and quality is essential to exploit their full potential. Over the last two decades, short (nanosecond (ns)) and ultra-short (picosecond (ps); femtosecond (fs)) pulse laser machining has been evaluated by various researchers and proposed as an alternative to the current state-of-the-art machining techniques for advanced materials like WC, which include mechanical grinding and electrical discharge machining. However, most of the established/existing research on this topic is based on low power lasers, which may not be adopted in industrial production environments due to its low material removal rate. This paper presents the results of a fundamental study, on using a 300 W picosecond laser for the deep machining of tungsten carbide. The influence of various laser parameters on the geometric precision and quality (surface and sub-surface) of the ablated area was analysed, and the ablation mechanism is discussed in detail. Laser pulse frequency and scanning speed have minimal effect on ablation rate at high power levels. The surface roughness of the ablated area increases with the ablation depth. At optimal conditions, no significant thermal defects such as a recast layer, micro crack or heat affected zone were observed, even at a high average power of 300 W. The material removal rate (MRR) seems to be proportional to the average power of the laser, and a removal rate of around 45 mm3 per minute can be achieved at 300 W power level. Edge wall taper appears to be a significant issue that needs to be resolved to enable industrial exploitation of high power ultra-short pulse lasers.