材料科学
阈下传导
晶体管
半导体
半导体器件
超大规模集成
集成电路
MOSFET
平面的
过程(计算)
半导体器件制造
电子线路
节点(物理)
制作
工程物理
纳米技术
光电子学
计算机科学
电子工程
电气工程
薄脆饼
工程类
电压
病理
计算机图形学(图像)
操作系统
替代医学
医学
结构工程
图层(电子)
出处
期刊:Silicon
[Springer Nature]
日期:2022-01-28
卷期号:14 (15): 9211-9222
被引量:7
标识
DOI:10.1007/s12633-022-01694-8
摘要
The VLSI industry has grown a lot for several decades. The Packing density of integrated circuits has been increased without compromising the functionality. Scaling of semiconductor devices, improvements in process technology and the development of new device designs are the key to this. Starting from the planar MOSFETs to novel multigate transistors, semiconductor devices have a history of many decades. There is a need for extensive exploration in order to determine the best suited semiconductor device for a given technology node. A brief overview of the transition from the planar MOSFET to the novel semiconductor devices and a comparative study of various novel semiconductor devices viz. FinFET, Gate all around FET, Vertical Nanowire and Nanosheet FET are presented in this paper. Optimization of the device configuration and improvements in device design/technology are also reviewed. A review of the device comparison on the basis of various device performance parameters such as subthreshold slope, On-Off current ratio, ease of fabrication, process variations and impact of scaling on figure of merits is presented in this paper.
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