Development of Self-releasing adhesive tape as a temporary bonding material for 3D integration

In this paper, self-releasing adhesive tape as a temporary bonding material is introduced, which generates N ₂ gas by using UV irradiation for self-releasing from wafer. It can separate the tape and the carrier easily without any residue on the surface with gas generation which makes the carrier float from the tape as if tape releases for itself. Other temporary bonding materials and techniques were reported in the past such as liquid type material using laser ablation or mechanical releasing materials. Advantages of this self-releasing adhesive tape will be discussed with comparing with other materials about residue on the wafer surface, TTV issue, releasing capability for very thin wafers and so on. This self-releasing adhesive tape performs over 200°C thermal resistance characteristic by adhesive design and UV process optimization. Further, advanced thermal resistance tape is under development for higher temperature such as 300°C and its possibility is shown. Based on these development results, our "Self-releasing adhesive tape" will be applicable in the various processes of 3D and heterogeneous packaging structures.