Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

环氧树脂 材料科学 复合材料 氮化硼 填料(材料) 热导率 复合数 结块 碳化硼 色散(光学) 光学 物理
作者
John M. Hutchinson,Sasan Moradi
出处
期刊:Materials [Multidisciplinary Digital Publishing Institute]
卷期号:13 (16): 3634-3634 被引量:37
标识
DOI:10.3390/ma13163634
摘要

Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.
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