研磨
超声波传感器
材料科学
陶瓷
叠加原理
蠕动
残余应力
平面磨削
冶金
复合材料
弯曲
机械工程
声学
工程类
量子力学
物理
作者
Eckart Uhlmann,G. Spur
出处
期刊:CIRP Annals
[Elsevier]
日期:1998-01-01
卷期号:47 (1): 249-252
被引量:119
标识
DOI:10.1016/s0007-8506(07)62828-5
摘要
The process performance in grinding of advanced ceramics can be enhanced by various kinematics of tool engagement. Based on the process principles of creep feed grinding with and without ultrasonic assistance, the surface formation of both methods is analyzed using analogy tests which simulate the engagement of single grains into the surface. The ultrasonic superposition leads to altered mechanisms of surface formation as well as wear behavior of grains. SEM-pictures, residual stress analyses and bending strength tests serve to evaluate surfaces ground both with and without ultrasonic assistance. This furnishes proof that ultrasonic assistance results in significantly higher removal rates, but not in an additional damage of the sub-surface.
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