均苯四甲酸二酐
聚酰亚胺
材料科学
热膨胀
退火(玻璃)
氢键
二胺
高分子化学
复合材料
化学工程
化学
有机化学
分子
图层(电子)
工程类
作者
Jianghuai Hu,Rengke Li,Chang Chen,Lu Zheng,Ke Zeng,Gang Yang
出处
期刊:Polymer
[Elsevier]
日期:2018-05-03
卷期号:146: 133-141
被引量:28
标识
DOI:10.1016/j.polymer.2018.05.001
摘要
Abstract Non-stretched adenine-containing polyimide films based on pyromellitic dianhydride (PMDA) and adenine-containing diamine (p-APA) were prepared and annealed at various temperatures. IR studies indicated the existence of transformation of hydrogen bonding types from N-H⋯N (in purine) to N-H⋯O (in carbonyl). The PMDA API films showed negative in-plane coefficient of thermal expansion (CTE) even annealed much higher than Tg. Morphology studies showed that the groups in PMDA API were inclined to self –arranged along the in-plane direction when annealed higher than Tg. The free volume fraction (FFV) of PMDA API films decreased with increasing annealing temperature. An orientation & hinge model was proposed to discuss the negative in-plane CTE behavior.
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