Recent Advancement of Research in Silver‐Based Solder Alloys

In recent times, Ag-based solders have appeared as a highly potential candidate in substituting health-hazardous Pb-containing solders. Silver possesses some unique properties required for high-temperature solders like good corrosion and oxidation resistance, excellent biocompatibility and workability, good thermal and electrical conductivity, and so on. In general, power semiconductor devices require interconnect materials to operate at high switching speeds, high current densities, and junction temperatures of more than 200 °C. Ag is one of the few viable candidates for satisfying these reliability and environmental criteria. This chapter focuses on the outcome of the recent research works in the development of Ag-based high-temperature solders along with their microstructural, thermal, mechanical, and electrical properties, and reliability issues. Finally, this chapter highlights current trends and up-and-coming researches in the implementation of Ag in soldering and die-attach applications.