腐蚀
材料科学
图层(电子)
薄膜晶体管
金属
冶金
电偶腐蚀
扩散
原电池
复合材料
物理
热力学
作者
Yue Wu,Shan Li,Shi‐Min Ge,Yuanping Xiong,Chun‐Sheng Jiang
摘要
Due to the low resistance and excellent glass adhesion, Cu/Mo dual‐layer metal wire has been widely used in TFT‐LCD industry. However, the galvanic reaction between the two metals, which may be the main cause of metal corrosion and diffusion in some failure TFT devices, has been seldom reported. According to the detailed study of the wet and rinse process, this work proposes a possible corrosion mechanism.
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