The Value of U.S. College Education in Global Labor Markets: Experimental Evidence from China

刻度(仪器) 中国 回调函数 工资 收益 考试(生物学) 价值(数学) 高等教育 工作(物理) 劳动经济学 经济 人口经济学 业务 政治学 公共关系 会计 经济增长 工程类 法学 机械工程 古生物学 机器学习 计算机科学 生物 程序设计语言
作者
Mingyu Chen
出处
期刊:Management Science [Institute for Operations Research and the Management Sciences]
卷期号:70 (2): 1276-1300 被引量:1
标识
DOI:10.1287/mnsc.2023.4745
摘要

One million international students study in the United States each year, and the majority of them compete in global labor markets after graduation. I conducted a large-scale field experiment and a companion employer survey to study how employers in China value U.S. college education. I sent more than 27,000 fictitious online applications to business and computer science jobs in China, randomizing the country of college education. I find that U.S.-educated applicants are on average 18% less likely to receive a callback than applicants educated in China, with applicants from very selective U.S. institutions underperforming those from the least selective Chinese institutions. The United States-China callback gap is smaller at high-wage jobs, consistent with employers fearing U.S.-educated applicants have better outside options and would be harder to hire and retain. The gap is also smaller at foreign-owned firms, consistent with Chinese-owned firms knowing less about American education. Controlling for high school quality, test scores, or U.S. work experiences does not attenuate the gap, suggesting that the gap is not driven by employer perceptions of negative selection. A survey of 507 hiring managers at college career fairs finds consistent and additional supporting evidence for the experimental findings. This paper was accepted by Yan Chen, behavioral economics and decision analysis. Funding: This work was supported by the Industrial Relations Section at Princeton University and the Prize Fellowship in Social Sciences awarded by Princeton School of Public and International Affairs. Supplemental Material: The data files and online appendices are available at https://doi.org/10.1287/mnsc.2023.4745 .
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