Creep behavior of different elliptical film cooling holes in complex temperature fields

This paper investigates the creep damage of film cooling holes with varying ellipticity within complex temperature fields. The temperature field, derived through the conjugate heat transfer method, serves as a boundary condition for crystal plastic finite element simulations. We discovered that film hole patterns with an ellipticity (λ) of ≤0.5 exhibit superior cooling effectiveness, particularly at a blowing ratio (B) of 1.0. For λ = 0.5, these holes demonstrate exceptional cooling effectiveness and mechanical properties. Reducing the ellipticity of film holes induces a shift in the high-stress region around the hole, subsequently diminishing stress concentration on the acute side of the hole. Moreover, the temperature difference between the edges on both sides of the hole perimeter and the upstream zone on the high-temperature surface for hole patterns with λ ≤ 0.5 introduces additional stress concentrations, with a significant temperature difference causing creep damage in this region.