材料科学
铁电性
反铁电性
薄膜
扫描透射电子显微镜
电容器
光电子学
电介质
极化(电化学)
电场
凝聚态物理
分析化学(期刊)
透射电子显微镜
电压
纳米技术
电气工程
物理
工程类
物理化学
化学
量子力学
色谱法
作者
Binjian Zeng,Lihua Yin,Ruiping Liu,Changfan Ju,Qinghua Zhang,Zhibin Yang,Shuaizhi Zheng,Qiangxiang Peng,Qiong Yang,Yichun Zhou,Min Liao
标识
DOI:10.1002/adma.202411463
摘要
Abstract HfO 2 ‐based multi‐bit ferroelectric memory combines non‐volatility, speed, and energy efficiency, rendering it a promising technology for massive data storage and processing. However, some challenges remain, notably polarization variation, high operation voltage, and poor endurance performance. Here we show Hf 1− x Zr x O 2 ( x = 0.65 to 0.75) thin films grown through sequential atomic layer deposition (ALD) of HfO 2 and ZrO 2 exhibiting three‐step domain switching characteristic in the form of triple‐peak coercive electric field ( E C ) distribution. This long‐sought behavior shows nearly no changes even at up to 125 °C and after 1 × 10 8 electric field cycling. By combining the electrical characterizations and integrated differential phase‐contrast scanning transmission electron microscopy (iDPC‐STEM), we reveal that the triple‐peak E C distribution is driven by the coupling of ferroelectric switching and reversible antiferroelectric–ferroelectric transition. We further demonstrate the 3‐bit per cell operation of the Hf 1− x Zr x O 2 capacitors with excellent device‐to‐device variation and long data retention, by the full switching of individual peaks in the triple‐peak E C . The work represents a significant step in implementing reliable non‐volatile multi‐state ferroelectric devices.
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