D2W Hybrid Bonding Challenges for HBM

This paper addresses the key requirements for a successful Die-to-Wafer hybrid bonding process for die stacking. The paper delves into requirements, principles, challenges, and advancements made using integrated processing equipment. The process requires key surface preparation steps integrated with the Hybrid bonders to achieve the highest levels of yield. Unique challenges for memory stacking including thin die handling, alignment, front and backside surface preparation.