材料科学
热塑性塑料
电负性
共价键
化学键
偷看
复合材料
金属
密度泛函理论
金属键合
混合功能
聚合物
计算化学
冶金
有机化学
化学
作者
Xiaoyang Bi,Mengjia Xu,Zhengchao Xie,Yan Li,Jiyu Tian,Zhenmin Wang,Zuankai Wang
标识
DOI:10.1021/acsami.2c14385
摘要
Metal–thermoplastic hybrid structures have proven their effectiveness to achieve lightweight design concepts in both primary and secondary structural components of advanced aircraft. However, the drastic differences in physical and chemical properties between metal and thermoplastic make it challenging to fabricate high-reliability hybrid structures. Here, a simple and universal strategy to obtain strong hybrid structures thermoplastics is reported by regulating the bonding behavior at metal/thermoplastic interfaces. To achieve such, we first researched and uncovered the bonding mechanism at metal/thermoplastic interfaces by experimental methods and density functional theory (DFT) calculations. The results suggest that the interfacial covalency, which is formed due to the interfacial reaction between high-electronegativity elements of thermoplastics and metallic elements at metal surfaces, dominates the interfacial bonding interaction of metal–thermoplastic hybrid structures. The differences in electronegativity and atomic size between bonding atoms influence the covalent-bond strength and finally control the interfacial reliability of hybrid structures. Based on our covalent-bonding mechanism, the carboxyl functional group (COOH) is specifically grafted on polyetheretherketone (PEEK) by plasma polymerization to increase the density and strength of interfacial covalency and thus fabricate high-reliability hybrid structures between PEEK and A6061-T6 aluminum alloy. Current work provides an in-depth understanding of the bonding mechanism at metal–thermoplastics interfaces, which opens a fascinating direction toward high-reliability metal–thermoplastic hybrid structures.
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