通量
材料科学
辐照
光电子学
中子通量
晶体管
中子
高电子迁移率晶体管
电压
电气工程
核物理学
物理
工程类
作者
X. Y. Cui,Keyu Ji,Taiping Zhang,Bingjun Wang,Wei Sha,Zilong Dong,Yuanhong Shi,Chunsheng Jiang,Qilin Hua,Weiguo Hu
标识
DOI:10.1002/admt.202200872
摘要
Abstract AlGaN/GaN‐based high electron mobility transistors (HEMTs) are ideal candidates for power electronics in consumer, industrial, and space applications. Attributed to their excellent performance in electrical output and chemical stability, AlGaN/GaN HEMTs enable tolerant neutron irradiation in harsh environments. Different from high‐fluence irradiation‐induced device failure, the investigation of low‐fluence neutron irradiation is of great significance to understand the early damage mechanism of HEMTs. Here, the modulated electrical properties are presented of AlGaN/GaN HEMTs under low‐fluence neutron irradiations of 4.5 × 10 13 and 6.0 × 10 13 cm −2 . After irradiation, the electrical characteristics of the samples are carefully measured, the output performance of different irradiated devices shows a similar change trend, i.e., almost no changes or only decreased slightly (≤14%) near the knee voltage. For leakage current, the samples irradiated with different fluences show different characteristics, including a slight decrease with the fluence of 4.5 × 10 13 cm −2 , and a slight increase with the fluence of 6.0 × 10 13 cm −2 . To further investigate the internal mechanisms, the performance changes are also simulated of the device by using Crosslight software. According to the measurements, it is concluded that the low‐fluence neutron irradiation will initially affect the 2DEG mobility and the surface states of the HEMTs.
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