聚醚酰亚胺
环氧树脂
材料科学
增韧
复合材料
固化(化学)
模数
溶解
聚合物
化学
有机化学
韧性
作者
C. B. Bucknall,A. H. Gilbert
出处
期刊:Polymer
[Elsevier]
日期:1989-02-01
卷期号:30 (2): 213-217
被引量:551
标识
DOI:10.1016/0032-3861(89)90107-9
摘要
Toughened epoxy resins have been prepared by dissolving polyetherimide (PEI) in a tetraglycidyl-4,4′-diaminodiphenyl methane (TGDDM) based resin with 30 p.h.r. diaminodiphenyl sulphone (DDS) as curing agent. The polyetherimide forms a separate phase, with a dynamic loss peak which varies between 200 and 212°C. The loss peak of the resin occurs at about 265°C. Three-point bend tests show a linear increase in KIC with PEI content, from 0.5MPa√m in the parent resin to 1.42MPa√m at 25 p.h.r. of PEI. Young's modulus at 23°C shows a modest reduction from 3.6 to 3.5 GPa over the same composition range.
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