氢氟酸
薄脆饼
范德瓦尔斯力
粒子(生态学)
硅
表面粗糙度
阳极连接
晶片键合
化学键
化学
直接结合
材料科学
分析化学(期刊)
化学工程
纳米技术
复合材料
无机化学
分子
有机化学
工程类
地质学
海洋学
作者
Karin Ljungberg,Ylva Bäcklund,Anders Söderbärg,Mats Bergh,Mats O. Andersson,Stefan Bengtsson
出处
期刊:Journal of The Electrochemical Society
[The Electrochemical Society]
日期:1995-04-01
卷期号:142 (4): 1297-1303
被引量:22
摘要
The effects of preparation of silicon surfaces in hydrofluoric acid solutions, prior to direct wafer bonding, is investigated. Surface analysis with atomic force microscopy, electron spectroscopy for chemical analysis, and estimation of the surface particle density is made. This is related to results from room temperature bonding experiments. A diluted (1–10%) solution is most favorable for hydrophobic silicon wafer bonding. The subsequent water rinse should be omitted, or performed in a careful way, to avoid particle contamination. solutions generally are not favorable for bonding. The initial room temperature bonding is attributed to the relatively weak van der Waals forces, which makes the bonding sensitive to the surface roughness and particle density. The surface chemistry appears to have a second order influence in hydrophobic bonding.
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