电源模块
可靠性(半导体)
噪音(视频)
电磁干扰
碳化硅
电容
功率(物理)
环氧树脂
材料科学
电气工程
温度循环
结温
干扰(通信)
计算机科学
电子工程
热的
工程类
物理
复合材料
电极
图像(数学)
量子力学
人工智能
频道(广播)
气象学
作者
Sihoon Choi,Jiyoon Choi,Thiyu Warnakulasooriya,Jong-Won Shin,Jun Imaoka,Masayoshi Yamamoto
出处
期刊:IEEE Access
[Institute of Electrical and Electronics Engineers]
日期:2024-01-01
卷期号:12: 90929-90939
被引量:1
标识
DOI:10.1109/access.2024.3420393
摘要
Silicon carbide devices provide higher switching speed and switching frequency than their silicon counterpart. However, these characteristics generate significant electromagnetic interference such as conducted common-mode (CM) noise. This paper proposes a novel power module to reduce CM noise without compromising size, thermal performance, and reliability of the power module. A specific part of the bottom copper layer of a directed-bonded copper is etched to reduce CM capacitance. Epoxy is used to increase mechanical reliability by supporting ceramic and top copper layers. This supporting epoxy also prevents an encapsulant from leaking into the etched area. Design methodologies for the proposed power module are provided in detail. Conventional and proposed power modules were prototyped and CM noise was experimentally measured with 400-V input, 200-V output, and 50-kHz switching frequency. The CM noise of the proposed power module was reduced by 5 dB $\mu $ V. Thermal cycling tests were conducted to confirm the degradation of the proposed power module. Cross-sections of the power modules and measured electrical characteristics verify the reliability of the proposed power module.
科研通智能强力驱动
Strongly Powered by AbleSci AI