数码产品
转印
纳米技术
计算机科学
柔性电子器件
3D打印
材料科学
工程类
机械工程
电气工程
作者
Yuyan Gao,Huanyu Cheng
出处
期刊:Journal of Electronic Packaging
[ASME International]
日期:2017-03-15
卷期号:139 (2)
被引量:13
摘要
Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in basic cell biology to multifunctional electronics for diagnostics/therapeutics. In this review article, we will first briefly introduce a few assembly techniques, such as microrobotic assembly, guided self-assembly, additive manufacturing, and transfer printing. Among various heterogeneous assembly techniques, transfer printing represents a simple yet versatile tool to integrate vastly different materials or structures in a single system. By utilizing such technique, traditionally challenging tasks have been enabled and they include novel experimental platforms for study of two-dimensional (2D) materials and cells, bio-integrated electronics such as stretchable and biodegradable devices, and three-dimensional (3D) assembly with advanced materials such as semiconductors.
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