材料科学
粘塑性
打滑(空气动力学)
应变率
机械加工
挤压
变形(气象学)
纹理(宇宙学)
碎屑形成
复合材料
炸薯条
硬化(计算)
电子背散射衍射
冶金
有限元法
结构工程
微观结构
本构方程
人工智能
刀具磨损
计算机科学
电信
物理
图像(数学)
图层(电子)
工程类
热力学
作者
Qingqing Wang,Ravi Shankar,Zhanqiang Liu,Yanhai Cheng
标识
DOI:10.1016/j.jmatprotec.2022.117588
摘要
Large strain extrusion machining (LSEM) is a promising process to create chip foils with ultrafine grains and a certain type of crystallographic texture. Disclosing the interconnection between the deformation histories and the crystallographic texture variations resulting from the LSEM process is vital for the texture generation and control of Ti-6Al-4V chip foils. Electron-backscattered diffraction and viscoplastic self-consistent (VPSC) simulation were combined based on numerical simulation to study evolutions of crystallographic textures for chip foils during LSEM of Ti-6Al-4V. The deformation histories during LSEM process were also analyzed by coupling theoretical analysis with digital image correlation technique. The role of individual type of slip system on the texture variation of Ti-6Al-4V chip foils was identified by modifying the Voce hardening parameters in VPSC model. It is seen that strain path controlled by the chip thickness ratio changes the inclination of generated textures in chip foils. Basal and 1-st order pyramidal slip systems are the main deformation modes in high strain rate deformation condition of LSEM process. Similar textures are formed under large strain and high strain rate deformation in LSEM comparing with that in free machining process. The conclusions are useful to control the crystallographic texture generation in LSEM of Ti-6Al-4V by optimizing cutting speeds and chip thickness ratios.
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