物理气相沉积
沉积(地质)
过程(计算)
气相沉积
吞吐量
材料科学
化学气相沉积
工艺工程
产品(数学)
简单(哲学)
纳米技术
计算机科学
薄膜
工程类
电信
地质学
数学
古生物学
哲学
几何学
认识论
沉积物
无线
操作系统
出处
期刊:Metal Finishing
[Elsevier]
日期:2002-01-01
卷期号:100: 394-408
被引量:46
标识
DOI:10.1016/s0026-0576(02)82043-8
摘要
Each of the PVD processes discussed has its advantages and disadvantages. Each requires different process monitoring and controlling techniques. Generally, the most simple technique and configuration that will give the desired film properties and most economical product throughput should be used. There are no “handbook values” for the properties of deposited thin films and the properties depend on the details of the deposition process. In order to have a reproducible process and product it is important to have good process controls.
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